solder                 package:rpart                 R Documentation

Soldering of Components on Printed-Circuit Boards

Description:

     The 'solder' data frame has 720 rows and 6 columns, representing a
     balanced subset of a designed experiment varying 5 factors on the
     soldering of components on printed-circuit boards.

Usage:

     solder

Format:

     This data frame contains the following columns:

     'Opening' a factor with levels 'L'  'M'  'S' indicating the amount
          of clearance around the mounting pad.

     'Solder' a factor with levels 'Thick'  'Thin' giving the thickness
          of the solder used.

     'Mask' a factor with levels 'A1.5'  'A3'  'B3'  'B6' indicating
          the type and thickness of mask used.

     'PadType' a factor with levels 'D4'  'D6'  'D7'  'L4'  'L6'  'L7' 
          'L8'  'L9'  'W4'  'W9' giving the size and geometry of the
          mounting pad.

     'Panel' '1:3' indicating the panel on a board being tested.

     'skips' a numeric vector giving the number of visible solder
          skips.

Source:

     John M. Chambers and Trevor J. Hastie eds. (1992) _Statistical
     Models in S_, Wadsworth and Brooks/Cole, Pacific Grove, CA 1992.

Examples:

     fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
            data=solder, method='anova')
     summary(residuals(fit))
     plot(predict(fit),residuals(fit))

